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1

Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters

Lim, Adeline B.Y., Chang, Andrew C.K., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.95 MB

english, 2014

2

Graphene Oxide-Templated Synthesis of Ultrathin or Tadpole-Shaped Au Nanowires with Alternating hcp and fcc Domains

Xiao Huang, Shaozhou Li, Shixin Wu, Yizhong Huang, Freddy Boey, Chee Lip Gan, Hua Zhang

Journal:

Advanced Materials

Year:

2012

Language:

english

File:

PDF, 1.36 MB

english, 2012

3

Self-Organization of a Hybrid Nanostructure consisting of a Nanoneedle and Nanodot

Hai Liu, Junsheng Wu, Ying Wang, Chee Lap Chow, Qing Liu, Chee Lip Gan, Xiaohong Tang, Rajdeep Singh Rawat, Ooi Kiang Tan, Jan Ma, Yizhong Huang

Journal:

Year:

2012

Language:

english

File:

PDF, 2.02 MB

english, 2012

4

Joining Copper Oxide Nanotube Arrays Driven by the Nanoscale Kirkendall Effect

Chun, Shu Rong, Sasangka, Wardhana Aji, Ng, Mei Zhen, Liu, Qing, Du, Anyan, Zhu, Jie, Ng, Chee Mang, Liu, Zhi Qiang, Chiam, Sing Yang, Gan, Chee Lip

Journal:

Year:

2013

Language:

english

File:

PDF, 1.94 MB

english, 2013

5

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Application of copper nanoparticles as die attachment for high power LED

Lee, Byung Hoon, Ng, Mei Zhen, Zinn, Alfred A., Gan, Chee Lip

Year:

2015

Language:

english

File:

PDF, 4.99 MB

english, 2015

6

Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution

Lim, Adeline B.Y., Boothroyd, Chris B., Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 3.06 MB

english, 2016

7

Iron-facilitated dynamic active-site generation on spinel CoAl2O4 with self-termination of surface reconstruction for water oxidation

Wu, Tianze, Sun, Shengnan, Song, Jiajia, Xi, Shibo, Du, Yonghua, Chen, Bo, Sasangka, Wardhana Aji, Liao, Hanbin, Gan, Chee Lip, Scherer, Günther G., Zeng, Lin, Wang, Haijiang, Li, Hui, Grimaud, Alexis

Journal:

Nature Catalysis

Year:

2019

Language:

english

File:

PDF, 2.87 MB

english, 2019

8

Photochemically Controlled Synthesis of Anisotropic Au Nanostructures: Platelet-like Au Nanorods and Six-Star Au Nanoparticles

Huang, Xiao, Qi, Xiaoying, Huang, Yizhong, Li, Shaozhou, Xue, Can, Gan, Chee Lip, Boey, Freddy, Zhang, Hua

Journal:

Year:

2010

Language:

english

File:

PDF, 327 KB

english, 2010

9

Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

Meng Keong Lim, Jingyuan Lin, Yong Chiang Ee, Chee Mang Ng, Jun Wei, Chee Lip Gan

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1014 KB

english, 2012

10

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng, Ming-Yuan, Je, Minkyu, Tan, Kwan Ling, Tan, Ee Lim, Lim, Ruiqi, Yao, Lei, Li, Peng, Park, Woo-Tae, Phua, Eric Jian Rong, Gan, Chee Lip, Yu, Aibin

Journal:

Journal of Micromechanics and Microengineering

Year:

2013

Language:

english

File:

PDF, 3.64 MB

english, 2013

11

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application

Chidambaram, Vivek, Bangtao, Chen, Lip, Gan Chee, Rhee Min Woo, Daniel

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.01 MB

english, 2014

12

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Study of thin film metallization adhesion in ceramic multichip module

Lim Ju Dy,, Rong, E. P. J., Riko, I. M., Sharif, A., Lim Jun Zhang,, Lau Fu Long,, Gan Chee Lip,, Chen Zhong,, MinWoo, D. R., Wong Chee Cheong,

Year:

2012

Language:

english

File:

PDF, 611 KB

english, 2012

13

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs

Made, Riko I, Gan, Chee Lip

Year:

2011

Language:

english

File:

PDF, 579 KB

english, 2011

14

[IEEE 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Shangri-La's Rasa Sentosa Resort, Singapore (27 June-1July, 2005)] Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. - Statistical and physical analysis of leakage and breakdown failure mechanisms of Cu/low-k interconnects

Tam Lyn Tan,, Hui Ping Lim,, Chee Lip Gan,, Nam Hwang,

Year:

2005

Language:

english

File:

PDF, 460 KB

english, 2005

15

[IEEE 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2012) - Singapore, Singapore (2012.07.2-2012.07.6)] 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Impact of pre-existing voids on electromigration in copper interconnects

Mario, Hendro, Lim, Meng Keong, Gan, Chee Lip

Year:

2012

Language:

english

File:

PDF, 836 KB

english, 2012

16

Bimodal Dielectric Breakdown Failure Mechanisms in Cu–SiOC Low- $k$ Interconnect System

Tan, Tam Lyn, Hwang, Nam, Gan, Chee Lip

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2007

Language:

english

File:

PDF, 580 KB

english, 2007

17

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Effect of palladium on the mechanical properties of Cu and Cu-Al intermetallic compounds

Lim, Adeline B. Y., Long, Xin, Shen, Lu, Chen, Xi, Ramanujan, Raju, Gan, Chee Lip, Chen, Zhong

Year:

2013

Language:

english

File:

PDF, 1.79 MB

english, 2013

18

Customized glass sealant for ceramic substrates for high temperature electronic application

Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.69 MB

english, 2014

19

[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Effects of side reservoirs on the electromigration lifetime of copper interconnects

Mario, Hendro, Gan, Chee Lip, Yeow Kheng Lim,, Juan Boon Tan,, Jun Wei,, Chookajorn, Tongjai, Thompson, Carl V.

Year:

2011

Language:

english

File:

PDF, 429 KB

english, 2011

20

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

Made, Riko I., Chee Lip Gan,, Chengkuo Lee,, LilingYan,, Aibin Yu,, Seung Wook Yoon,

Year:

2008

Language:

english

File:

PDF, 229 KB

english, 2008

21

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate

Kim, Jaewon, Lee, Byunghoon, Lek, Jun Yan, Made, Riko I, Salam, Budiman, Gan, Chee Lip

Year:

2014

Language:

english

File:

PDF, 362 KB

english, 2014

22

Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers

Sasangka, Wardhana A, Gan, Chee Lip, Lai, Donny, Tan, Chuan Seng, Thompson, Carl V

Journal:

Journal of Micromechanics and Microengineering

Year:

2015

Language:

english

File:

PDF, 2.32 MB

english, 2015

23

Stabilization of 4H hexagonal phase in gold nanoribbons

Fan, Zhanxi, Bosman, Michel, Huang, Xiao, Huang, Ding, Yu, Yi, Ong, Khuong P., Akimov, Yuriy A., Wu, Lin, Li, Bing, Wu, Jumiati, Huang, Ying, Liu, Qing, Eng Png, Ching, Lip Gan, Chee, Yang, Peidong, Z

Journal:

Nature Communications

Year:

2015

Language:

english

File:

PDF, 8.91 MB

english, 2015

24

Evaluation of the corrosion performance of Cu–Al intermetallic compounds and the effect of Pd addition

Lim, Adeline B.Y., Neo, Wei Jian, Yauw, Oranna, Chylak, Bob, Gan, Chee Lip, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.46 MB

english, 2015

25

[IEEE 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hsinchu (2015.6.29-2015.7.2)] 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits - Evaluation of copper nanoparticles for low temperature bonded interconnections

Byung Hoon Lee,, Mei Zhen Ng,, Zinn, Alfred A., Chee Lip Gan,

Year:

2015

Language:

english

File:

PDF, 1.11 MB

english, 2015

26

Atmospheric corrosion resistance of electroplated Ni/Ni–P/Au electronic contacts

Murugan, Vinod K., Jia, Zhigang, Syaranamual, Govindo J., Gan, Chee Lip, Huang, Yizhong, Chen, Zhong

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 3.25 MB

english, 2016

27

Extensive Laser Fault Injection Profiling of 65 nm FPGA

Breier, Jakub, He, Wei, Bhasin, Shivam, Jap, Dirmanto, Chef, Samuel, Ong, Hock Guan, Gan, Chee Lip

Journal:

Journal of Hardware and Systems Security

Year:

2017

Language:

english

File:

PDF, 3.20 MB

english, 2017

28

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnection

Kim, Jaewon, Lee, Byunghoon, Koo, Ja-Myeong, Gan, Chee Lip

Year:

2017

Language:

english

File:

PDF, 1.73 MB

english, 2017

29

Shape-Memory Actuation in Aligned Zirconia Nanofibers for Artificial Muscle Applications at Elevated Temperatures

Du, Zehui, Zhou, Xinran, Ye, Pengcheng, Zeng, Xiaomei, Gan, Chee Lip

Journal:

ACS Applied Nano Materials

Year:

2020

File:

PDF, 3.39 MB

2020

30

Ag-Sn transient liquid phase bonding for high temperature electronic packaging: effect of Ag content

Nobeen, Nadeesh Singh, Yan, Guangxu, Gan, Chee Lip, Chen, Zhong

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 1.64 MB

2020

31

Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Syed M. Alam, Chee Lip Gan, Carl V. Thompson, Donald E. Troxel

Journal:

Microelectronics Journal

Year:

2007

Language:

english

File:

PDF, 815 KB

english, 2007

32

Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate

Gaurav Sharma, Ser Choong Chong, Liao Ebin, Cai Hui, Chee Lip Gan, Vaidyanathan Kripesh

Journal:

Thin Solid Films

Year:

2007

Language:

english

File:

PDF, 1.77 MB

english, 2007

33

Surface-Induced Synthesis and Self-Assembly of Metal Suprastructures

Shaozhou Li, Xiao Huang, Hai Li, Hui Cai, Chee Lip Gan, Freddy Boey, Hua Zhang

Journal:

Year:

2010

Language:

english

File:

PDF, 888 KB

english, 2010

34

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau, Chengkuo Lee

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 442 KB

english, 2009

35

Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films

Wardhana A. Sasangka, Chee Lip Gan, Carl V. Thompson, Won Kyoung Choi, Jun Wei

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 2.11 MB

english, 2011

36

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Riko I Made, Chee Lip Gan, Liling Yan, Katherine Hwee Boon Kor, Hong Ling Chia, Kin Leong Pey, Carl V. Thompson

Journal:

Acta Materialia

Year:

2012

Language:

english

File:

PDF, 1.33 MB

english, 2012

37

Ultra-high-density phase-change storage using AlNiGd metallic glass thin film as recording layer

Mei Ling Lee, K. Khine Win, Chee Lip Gan, Lu Ping Shi

Journal:

Year:

2010

Language:

english

File:

PDF, 528 KB

english, 2010

38

High-resolution mastering using AlNiGd metallic glass thin film as thermal absorption layer

Mei Ling Lee, Gao Qiang Yuan, Chee Lip Gan, Lung Tat Ng, Chow Tian Lim, Kai Dong Ye

Journal:

Year:

2010

Language:

english

File:

PDF, 712 KB

english, 2010

39

Nickel Cobalt Oxide-Single Wall Carbon Nanotube Composite Material for Superior Cycling Stability and High-Performance Supercapacitor Application

Wang, Xu, Han, Xuanding, Lim, Mengfang, Singh, Nandan, Gan, Chee Lip, Jan, Ma, Lee, Pooi See

Journal:

The Journal of Physical Chemistry C

Year:

2012

Language:

english

File:

PDF, 2.25 MB

english, 2012

40

Electromigration-induced extrusion failures in Cu/low-k interconnects

Wei, Frank L., Gan, Chee Lip, Tan, Tam Lyn, Hau-Riege, Christine S., Marathe, Amit P., Vlassak, Joost J., Thompson, Carl V.

Journal:

Journal of Applied Physics

Year:

2008

Language:

english

File:

PDF, 1.19 MB

english, 2008

41

Forest of Gold Nanowires: A New Type of Nanocrystal Growth

He, Jiating, Wang, Yawen, Feng, Yuhua, Qi, Xiaoying, Zeng, Zhiyuan, Liu, Qing, Teo, Wei Shan, Gan, Chee Lip, Zhang, Hua, Chen, Hongyu

Journal:

Year:

2013

Language:

english

File:

PDF, 1.82 MB

english, 2013

42

Synthesis of hexagonal close-packed gold nanostructures

Huang, Xiao, Li, Shaozhou, Huang, Yizhong, Wu, Shixin, Zhou, Xiaozhu, Li, Shuzhou, Gan, Chee Lip, Boey, Freddy, Mirkin, Chad A., Zhang, Hua

Journal:

Nature Communications

Year:

2011

Language:

english

File:

PDF, 1004 KB

english, 2011

43

Vapor–Liquid–Solid Growth of Endotaxial Semiconductor Nanowires

Li, Shaozhou, Huang, Xiao, Liu, Qing, Cao, Xiehong, Huo, Fengwei, Zhang, Hua, Gan, Chee Lip

Journal:

Year:

2012

Language:

english

File:

PDF, 1.26 MB

english, 2012

44

Towards Perfectly Ordered Novel ZnO/Si Nano-Heterojunction Arrays

Yadian, Boluo, Liu, Hai, Wei, Yuefan, Wu, Junsheng, Zhang, Sen, Sun, Linfeng, Zhao, Chunwang, Liu, Qing, Ramanujan, Raju V., Zhou, Kun, Gan, Chee Lip, Huang, Yizhong

Journal:

Year:

2014

Language:

english

File:

PDF, 1.55 MB

english, 2014

45

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications

Chidambaram, Vivek, Rong, Eric Phua Jian, Lip, Gan Chee, Daniel, Rhee Min Woo

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 934 KB

english, 2013

46

Nano-scale oxidation of copper in aqueous solution

Wu, Junsheng, Li, Xiaogang, Yadian, Boluo, Liu, Hai, Chun, Shurong, Zhang, Bowei, Zhou, Kun, Gan, Chee Lip, Huang, Yizhong

Journal:

Electrochemistry Communications

Year:

2013

Language:

english

File:

PDF, 842 KB

english, 2013

47

SPIE Proceedings [SPIE SPIE Proceedings - (Sunday 12 February 2012)] - Synthesis, characterization, and photoluminescence of β-Ga2O3 nanofibers

Lam, Hwee M., Hong, Ming Hui, Gan, Chee Lip, Chong, Tow Chong, Miyamoto, Isamu, Helvajian, Henry, Itoh, Kazuyoshi, Kobayashi, Kojiro F., Ostendorf, Andreas, Sugioka, Koji

Year:

2012

Language:

english

File:

PDF, 346 KB

english, 2012

48

Controlled Synthesis of Copper-Silicide Nanostructures

Li, Shaozhou, Cai, Hui, Gan, Chee Lip, Guo, Jun, Dong, Zhili, Ma, Jan

Journal:

Crystal Growth & Design

Year:

2010

Language:

english

File:

PDF, 4.32 MB

english, 2010

49

Transient liquid phase Ag-based solder technology for high-temperature packaging applications

Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong

Journal:

Journal of Alloys and Compounds

Year:

2014

Language:

english

File:

PDF, 1.01 MB

english, 2014

50

Improved mechanical and thermomechanical properties of alumina substrate via iron doping

I Made, Riko., Phua, Eric Jian Rong, Pramana, Stevin Snellius, Wong, Chee Cheong, Chen, Zhong, Tok, Alfred Iing Yoong, Gan, Chee Lip

Journal:

Scripta Materialia

Year:

2013

Language:

english

File:

PDF, 379 KB

english, 2013